Paper Contents
Abstract
AbstractEfficient thermal management of microelectronic components remains a critical challenge in modern electronics, especially with the rising trend of device miniaturization and increasing power density. Among passive cooling techniques, pulsating heat pipes (PHPs) have emerged as a promising solution due to their simple structure and effective heat transfer characteristics. This study investigates the performance of a copper-based pulsating heat pipe under varying filling ratios ranging from 45% to 60%, using different working fluids including methanol, acetone, and butanol. The microprocessors considered exhibit thermal design power (TDP) between 65W and 350W, reflecting contemporary and anticipated future thermal loads. Experimental analysis focuses on evaluating thermal resistance and average evaporator temperature under different heat inputs for the selected fluids, particularly emphasizing behavior at a 50% filling ratio. The findings provide insights into optimal PHP configurations and fluid selection for efficient microprocessor cooling.
Copyright
Copyright © 2025 Shubham kanungo. This is an open access article distributed under the Creative Commons Attribution License.
